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COPPER WIRE BONDINGMAYER, Michael; LAI, YI-Shao.Microelectronics and reliability. 2011, Vol 51, Num 1, issn 0026-2714, 189 p.Serial Issue
Design of thermal imprinting system with uniform residual thicknessSHIN, Won-Ho.Microelectronic engineering. 2009, Vol 86, Num 11, pp 2222-2227, issn 0167-9317, 6 p.Article
The emergence of high volume copper ball bondingDELEY, Michael.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 186-190, isbn 0-7803-8582-9, 1Vol, 5 p.Conference Paper
Fine and ultra-fine pitch wire bonding: challenges and solutionsZHONG, Z. W.Microelectronics international. 2009, Vol 26, Num 2, pp 10-18, issn 1356-5362, 9 p.Article
Suppression of Microwave Resonances in Wirebond Transitions Between Conductor-Backed Coplanar WaveguidesLIM, Juhwan; KIM, Gyoungbum; HWANG, Sungwoo et al.IEEE microwave and wireless components letters. 2008, Vol 18, Num 1, pp 31-33, issn 1531-1309, 3 p.Article
A broadband 8-18GHz 4-input 4-output butler matrixMILNER, Leigh; PARKER, Michael.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 641406.1-641406.9, issn 0277-786X, isbn 978-0-8194-6522-1, 1VolConference Paper
Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubitsWENNER, J; NEELEY, M; MARTINIS, John M et al.Superconductor science & technology (Print). 2011, Vol 24, Num 6, issn 0953-2048, 065001.1-065001.7Article
Wire bonding using insulated wire and new challenges in wire bondingZHONG, Z. W.Microelectronics international. 2008, Vol 25, Num 2, pp 9-14, issn 1356-5362, 6 p.Article
Guidelines for improving intermetallic reliabilityLEVINE, Lee; OSBORNE, Matt; KELLER, Rank et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 174-176, isbn 0-7803-8582-9, 1Vol, 3 p.Conference Paper
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bondingREZVANI, A; SHAH, A; MAYER, M et al.Microelectronics and reliability. 2013, Vol 53, Num 7, pp 1002-1008, issn 0026-2714, 7 p.Article
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemesENGLAND, Luke; SIEW TZE ENG; LIEW, Chris et al.Microelectronics and reliability. 2011, Vol 51, Num 1, pp 81-87, issn 0026-2714, 7 p.Article
Advanced wire bond looping technology for emerging packagesBRUNNER, Jon; QIN, Ivy Wei; CHYLAK, Bob et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 85-90, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper
A TSV-Based Bio-Signal Package With μ-Probe ArrayCHOU, Lei-Chun; LEE, Shih-Wei; CHEN, Kuo-Hua et al.IEEE electron device letters. 2014, Vol 35, Num 2, pp 256-258, issn 0741-3106, 3 p.Article
Insulated Cu wire free air ball characterizationHUNGYANG LEONG; BOONKAR YAP; KHAN, Navas et al.Microelectronics and reliability. 2014, Vol 54, Num 8, pp 1567-1574, issn 0026-2714, 8 p.Article
Experimental and analytical study on chip hot spot temperatureBYON, Chan; CHOO, Kyosung; SUNG JIN KIM et al.International journal of heat and mass transfer. 2011, Vol 54, Num 9-10, pp 2066-2072, issn 0017-9310, 7 p.Article
Wire-to-wire bonding of mμ-diameter aluminum wires for the Electric Solar Wind SailSEPPÄNEN, Henri; KIPRICH, Sergiy; KURPPA, Risto et al.Microelectronic engineering. 2011, Vol 88, Num 11, pp 3267-3269, issn 0167-9317, 3 p.Article
Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper PadJENG, Yeau-Ren; CHIU, Sang-Mao; HUANG, Pay-Yau et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 1, pp 65-70, issn 1521-334X, 6 p.Article
Low-Stress Thermosonic Copper Ball BondingSHAH, Aashish; MAYER, Michael; NORMAN ZHOU, Y et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 176-184, issn 1521-334X, 9 p.Article
Fast Matching Location Algorithm Based on Mixed Moment for Wire BondingKONG, Fan Zhi; ZHANG, Xing Zhou; WANG, Yi Zhong et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7159, issn 0277-786X, isbn 978-0-8194-7403-2 0-8194-7403-7, 71590F.1-71590F.9Conference Paper
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature riseYONG DING; KIM, Jang-Kyo.Microelectronics and reliability. 2008, Vol 48, Num 1, pp 149-157, issn 0026-2714, 9 p.Article
Study of factors affecting the hardness of ball bonds in copper wire bondingZHONG, Z. W; HO, H. M; TAN, Y. C et al.Microelectronic engineering. 2007, Vol 84, Num 2, pp 368-374, issn 0167-9317, 7 p.Article
The wire sweep analysis based on the evaluation of the bending and twisting moments for semiconductor packagingKUNG, Huang-Kuang; LEE, Jeng-Nan; WANG, Chin-Yu et al.Microelectronic engineering. 2006, Vol 83, Num 10, pp 1931-1939, issn 0167-9317, 9 p.Article
Effect of chromium-gold and titanium- titanium nitride-platinum-gold metallization on wire/ribbon bondabilityJIANBIAO PAN; PAFCHEK, Robert M; JUDD, Frank F et al.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 180-185, isbn 0-7803-8582-9, 1Vol, 6 p.Conference Paper
Predicting bond failure after 1.5 ms of bonding, an initial studyTIETÄVÄINEN, Aino; RAUHALA, Timo; SEPPÄNEN, Henri et al.Microelectronics and reliability. 2014, Vol 54, Num 6-7, pp 1452-1454, issn 0026-2714, 3 p.Article
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parametersLIM, Adeline B. Y; CHANG, Andrew C. K; YAUW, Oranna et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2555-2563, issn 0026-2714, 9 p.Article